CAIG Rosin Soldering Flux
Recommended for electrical and electronic soldering applications
This paste flux meets DOD-STD-2000 & also the IPC-J-004 standard for type ROL0,
the lowest residue corrosivity category
CAIG Rosin Soldering Flux
TYPE RSF-R80
+ RSF-R80 Rosin Flux is a mildly-activated rosin flux
that is considerably more active than water-white rosin
+ Activity closely approaches that of fully activated rosins
+ Conforms to all of the requirements of Type RMA
+ Rosin Core, Mildly Activated of Federal Specification QQ-S-571
+ The RSF paste ux meets DOD-STD-2000
& also the IPC-J-004 standard for type ROL0,
the lowest residue corrosivity category
+ Thermal stability enabling excellent wetting and reduced
carbonization at soldering temperatures
CAIG Rosin NO-CLEAN Soldering Flux
TYPE RSF-R39
+ RSF-R39 Rosin No Clean Flux is a mildly-activated rosin flux
that is considerably more active than water-white rosin
+ Recommended for electrical and electronic soldering applications
+ Excellent for P.C.B repair and rework
+ No refrigeration necessary
+ Can be safely left on the circuit board after reflow without cleaning
+ Appearance: Smooth and tacky amber paste
+ Viscosity (Malcom): Typically 200 – 280 at 5 rpm @ 25°C
+ Tack strength (per IPC J-STD-004): Initial TBD 6 hr @ 50%RH TBD 24 hr @ 50%RH TBD Fineness of Grind < 10 micrometer Acid Number (mg KOH/g) 90-110 + Halide content ROL0, per IPC J-STD-004, Halide free
+ Halogen content None intentionally added
+ IPC SIR J-STD-004B Pass
+ Bellcore SIR (pass > 1011) Pass, 8.9X109, Ohms at 96 hours 2.2X1010 at 500 hours Pass/Fail = final > initial/10)